As always, we have tried to cover all types of floorcovering installation: carpet, wood, ceramic, and resilient. Following is a preview of what we have to offer in this special issue. For carpet, columnist Michael Hetts offers tried-and-true troubleshooting tips. For wood, columnist Mickey Moore shows how to troubleshoot cupping conditions in wood floors. For the highly requested subject of ceramic, we have two subjects: columnist Michael Byrne address crack isolation techniques, and Dave Gobis of CTEF delves into the ins and outs of thinset application. Last but not least, columnist Jon Namba digs into his hefty bag of tricks to offer troubleshooting tips for resilient and laminate flooring installation. To round off this month’s features, columnist Joe Grady gets to the bottom of adhesive terminology, and columnist Bill Baxley examines mold-related damage in several resilient installations.
So, enjoy this special issue, and please let us know what you think of it, such as what you enjoyed most, and what you would like to see featured in this issue next year. Since this is a new issue, we really want to know what you think about this new format, and what we can do to improve it for next time. You can even ask any floorcovering installation questions you might have for our columnists. We will take these ideas and questions into consideration for this issue next year. You can send your comments via e-mail to: MooreJ@bnp.com or mail them to Business News Publishing, ATTN: John Moore, 22801 Ventura Blvd, Ste. 115, Woodland Hills, CA 91364-1222. Please take a moment and send in any questions or suggestions you might have. Who knows, your question or topic may end up in next year’s guide.