W.F. Taylor unveils ‘next generation technology' with MS-Plus adhesive
May 18, 2007
W.F. Taylor Co. Inc. has introduced its latest development in Next Generation technology, MS-Plus Wood Flooring Adhesive. Formulated with Taylor’s patented Meta-tec® technology with Telechelic Modified Silane Polymer chemistry, the 100% solids moisture cure adhesive features: improved early green strength, excellent moisture resistance and a strong, elastic bond for the installation of all types of engineered and solid wood flooring. Greenguard® tested and approved. Circle 310 on the Reader Inquiry Card.